First Automotive Chiplet Program partners announced by imec
Although chiplet architectures are increasingly being used to enhance the computing power of servers and smartphones, the automotive industry has been reluctant to move towards chiplets for central vehicle computer design.
Several automotive players have decided to accelerate the journey on this promising path by joining imec’s Automotive Chiplet Program. This pre-competitive research effort is designed to address the unique challenges related to automotive chiplets: strict robustness and reliability requirements, cost, and en energy efficiency.
Specifically, the automotive chiplet program will leverage imec’s track record in 2.5D and 3D packaging to evaluate which chiplet architectures and packaging technologies are best suited to support specific high-performance computing requirements.
The names of the first participants were announced during the Automotive Chiplet Forum: Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent, and Valeo.